Broadcom is in discussions with a group of lenders over a debt package worth more than 60 billion dollars, part of a financing arrangement tied to AI chip production that is expected to benefit Anthropic and other companies, according to people familiar with the matter.
The talks are still ongoing, and the arrangement could include a junior debt tranche worth roughly 30 billion dollars on its own, on top of the broader financing package, some of the people said. Terms have not been finalized, and the people asked not to be named because the discussions are private.
The scale of the financing highlights how central Broadcom has become to the AI buildout, both as a maker of networking chips that link together large clusters of processors and as a partner that helps design custom AI chips for major technology companies. Anthropic, the AI company behind the Claude family of models, has increasingly relied on custom chip partnerships to help meet growing computing demands as it scales up its models.
Large debt deals of this size have become more common across the AI industry, as chipmakers and their customers look to spread the enormous upfront cost of building out data center and chip production capacity. Lenders have shown strong appetite for these arrangements given the scale of committed spending from major AI companies, even as some analysts continue to watch closely for signs of how sustainable that pace of spending will prove over time.
Broadcom has not commented publicly on the terms of the financing or confirmed which companies beyond Anthropic may benefit from the arrangement.